Designed primarily for copper to copper and copper to brass connections the paste form is ideal for soldering tube joints. Not recommended for electrical or electronic applications due to the potential corrosive residue of the flux. Stay Clean paste flux works well with most leaded and lead-free solder compositions. Flux residue should be removed after soldering.
Brand
Harris Products Group
Net Content
4 oz
Container Type
Brush Cap Bottle
Composition
<40% Zinc Chloride, <15% Ethanediol, <10% Ammonium Chloride, 30 to 80% Petrolatum, 1 to 10% Water
Form
Paste
Color
Opaque Silver
Odor/Scent
Odorless
Specific Gravity
1.11
Temperature Rating
700 deg F
Vapor Pressure
0.1 psig
Density
1.106
Melting Point
99 to 140 deg F